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Publication search results
found 13 matches
- 2017
- Joseph B. Bernstein
, Alain Bensoussan
, Emmanuel Bender
:
Reliability prediction with MTOL. Microelectron. Reliab. 68: 91-97 (2017) - Eleni Chatzikyriakou
, William Redman-White, C. H. De Groot:
Total Ionizing Dose, Random Dopant Fluctuations, and its combined effect in the 45 nm PDSOI node. Microelectron. Reliab. 68: 21-29 (2017) - Nikolaos Eftaxiopoulos, Nicholas Axelos, Kiamal Z. Pekmestzi:
DIRT latch: A novel low cost double node upset tolerant latch. Microelectron. Reliab. 68: 57-68 (2017) - Peter Ersland, Roberto Menozzi
:
Editorial. Microelectron. Reliab. 68: 1 (2017) - Zhongmin Lai, Xinda Kong, Qingrong You, Xiubin Cao:
Microstructure and mechanical properties of Co/Sn-10Bi couple and Co/Sn-10Bi/Co joint. Microelectron. Reliab. 68: 69-76 (2017) - B. S. Poling, Glen David Via, K. D. Bole, E. E. Johnson, J. M. McDermott:
Commercial-off-the-shelf algan/gan hemt device reliability study after exposure to heavy ion radiation. Microelectron. Reliab. 68: 13-20 (2017) - Alexander Pooth, Johan Bergsten, Niklas Rorsman
, Hassan Hirshy
, R. Perks, Paul J. Tasker, Trevor Martin, Richard F. Webster
, Dave Cherns, Michael J. Uren
, Martin Kuball:
Morphological and electrical comparison of Ti and Ta based ohmic contacts for AlGaN/GaN-on-SiC HFETs. Microelectron. Reliab. 68: 2-4 (2017) - Pushparajah Rajaguru, Hua Lu, Chris Bailey
, Jose Angel Ortiz Gonzalez
, Olayiwola Alatise
:
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3.5Ag solder interconnect in power electronic module: A finite element analysis perspective. Microelectron. Reliab. 68: 77-85 (2017) - Akito Sasaki, Hideyuki Oozu, Miho Nakamura, Katsuaki Aoki, Yoshinori Kataoka, Syuichi Saito, Kumpei Kobayashi, Wei Li, Kuniyuki Kakushima, Kazuo Tsutsui, Hiroshi Iwai:
Durability evaluation of hexagonal WO3 electrode for lithium ion secondary batteries. Microelectron. Reliab. 68: 86-90 (2017) - Shaker Farid Sufian
, Mohd Zulkifly Abdullah
:
Heat transfer enhancement of LEDs with a combination of piezoelectric fans and a heat sink. Microelectron. Reliab. 68: 39-50 (2017) - Charles S. Whitman, Michael G. Meeder, Peter J. Zampardi:
Determination of safe reliability region over temperature and current density for through wafer vias. Microelectron. Reliab. 68: 5-12 (2017) - Xiuqin Xu, Jiongjiong Mo, Wei Chen, Zhiyu Wang, Yong-Heng Shang, Yang Wang, Qin Zheng, Liping Wang, Zheng-Liang Huang, Fa-Xin Yu:
A new meshing criterion for the equivalent thermal analysis of GaAs PHEMT MMICs. Microelectron. Reliab. 68: 30-38 (2017) - Wenyi Zhu, Binghan Li, Tao Yu, Weiran Kong, Shichang Zou:
Investigation of read disturb in split-gate memory and its feasible solution. Microelectron. Reliab. 68: 51-56 (2017)
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