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"A Study of Tapered 3-D TSVs for Power and Thermal Integrity."
Aida Todri et al. (2013)
- Aida Todri
, Sandip Kundu, Patrick Girard, Alberto Bosio, Luigi Dilillo, Arnaud Virazel
:
A Study of Tapered 3-D TSVs for Power and Thermal Integrity. IEEE Trans. Very Large Scale Integr. Syst. 21(2): 306-319 (2013)
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