"Assessing Benefits of a Buried Interconnect Layer in Digital Designs."

Liheng Zhu et al. (2017)

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DOI: 10.1109/TCAD.2016.2572144

access: closed

type: Journal Article

metadata version: 2021-10-28

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  - https://dblp.org/rec/journals/tcad/ZhuBWIG17
Liheng Zhu, Yasmine Badr, Shaodi Wang, Subramanian S. Iyer, Puneet Gupta:
Assessing Benefits of a Buried Interconnect Layer in Digital Designs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 36(2): 346-350 (2017)

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