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"Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC."

Qi Xu et al. (2022)

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DOI: 10.1109/TCAD.2021.3084920

access: closed

type: Journal Article

metadata version: 2022-05-18

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  - https://dblp.org/rec/journals/tcad/XuSCKW22
Qi Xu, Wenhao Sun, Song Chen, Yi Kang, Xiaoqing Wen:
Cellular Structure-Based Fault-Tolerance TSV Configuration in 3D-IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 41(5): 1196-1208 (2022)

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