"More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs."

Taigon Song et al. (2016)

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DOI: 10.1109/TCAD.2016.2550583

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type: Journal Article

metadata version: 2022-10-02

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Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim:
More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 35(12): 2056-2067 (2016)

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