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"Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs."

Jiwoo Pak, Sung Kyu Lim, David Z. Pan (2014)

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DOI: 10.1109/TCAD.2014.2360456

access: closed

type: Journal Article

metadata version: 2022-10-02

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Jiwoo Pak, Sung Kyu Lim, David Z. Pan:
Electromigration Study for Multiscale Power/Ground Vias in TSV-Based 3-D ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(12): 1873-1885 (2014)

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