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"A TSV Fault-Tolerant Scheme Based on Failure Classification in 3D-NoC."

Yiming Ouyang et al. (2017)

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DOI: 10.1142/S0218126617500591

access: closed

type: Journal Article

metadata version: 2020-08-25

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  dblp key:
  - journals/jcsc/OuyangDWHLD17
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  persistent URL:
  - https://dblp.org/rec/journals/jcsc/OuyangDWHLD17
Yiming Ouyang, Jian Da, Xiumin Wang, Qianqian Han, Huaguo Liang, Gaoming Du:
A TSV Fault-Tolerant Scheme Based on Failure Classification in 3D-NoC. J. Circuits Syst. Comput. 26(4): 1750059:1-1750059:19 (2017)

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