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"Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout."

Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim (2013)

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DOI: 10.1109/TVLSI.2012.2201760

access: closed

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/tvlsi/KimAL13
Dae Hyun Kim, Krit Athikulwongse, Sung Kyu Lim:
Study of Through-Silicon-Via Impact on the 3-D Stacked IC Layout. IEEE Trans. Very Large Scale Integr. Syst. 21(5): 862-874 (2013)

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