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"3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D ..."

Jaeyong Jeong et al. (2022)

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DOI: 10.1109/VLSITECHNOLOGYANDCIR46769.2022.9830449

access: closed

type: Conference or Workshop Paper

metadata version: 2022-08-04

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Jaeyong Jeong, Seong Kwang Kim, Jongmin Kim, Dae-Myeong Geum, Jisung Lee, Seung-Young Park, Sanghyeon Kim:
3D stackable cryogenic InGaAs HEMTs for heterogeneous and monolithic 3D integrated highly scalable quantum computing systems. VLSI Technology and Circuits 2022: 328-329

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