Stop the war!

Остановите войну!

for scientists:

default search action

combined dblp search
author search
venue search
publication search

ask others

"Thermal-aware cell and through-silicon-via co-placement for 3D ICs."

Jason Cong, Guojie Luo, Yiyu Shi (2011)

> Home

Details and statistics

DOI: 10.1145/2024724.2024876

access: closed

type: Conference or Workshop Paper

metadata version: 2022-12-13

- view
  - electronic edition via DOI
  - unpaywalled version
  authority control:
- export record
  dblp key:
  - conf/dac/CongLS11
- ask others
- share record
  persistent URL:
  - https://dblp.org/rec/conf/dac/CongLS11
Jason Cong, Guojie Luo, Yiyu Shi:
Thermal-aware cell and through-silicon-via co-placement for 3D ICs. DAC 2011: 670-675

a service of

manage site settings

To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.