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"Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling."
Zhenyu Wang et al. (2023)
- Zhenyu Wang, Jingbo Sun, A. Alper Goksoy, Sumit K. Mandal, Jae-Sun Seo, Chaitali Chakrabarti, Ümit Y. Ogras, Vidya A. Chhabria, Yu Cao:
Benchmarking Heterogeneous Integration with 2.5D/3D Interconnect Modeling. ASICON 2023: 1-4
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