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R. S. Bhatti

Raj S. Bhatti

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Journal Articles

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2014
[j4]
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  - https://dblp.org/rec/journals/mj/EkpuBOMO14
Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba:
The effect of thermal constriction on heat management in a microelectronic application. Microelectron. J. 45(2): 159-166 (2014)
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Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba:
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectron. Reliab. 54(1): 239-244 (2014)
2012
[j2]
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  - journals/mr/OtiabaBEMAAE12
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Kenny C. Otiaba, R. S. Bhatti, Ndy N. Ekere, Sabuj Mallik, M. O. Alam, Emeka H. Amalu, Mathias Ekpu:
Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectron. Reliab. 52(7): 1409-1419 (2012)
2011
[j1]
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Kenny C. Otiaba, Ndy N. Ekere, R. S. Bhatti, Sabuj Mallik, M. O. Alam, Emeka H. Amalu:
Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectron. Reliab. 51(12): 2031-2043 (2011)

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