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"Fatigue life of lead-free solder thermal interface materials at varying ..."

Mathias Ekpu et al. (2014)

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DOI: 10.1016/J.MICROREL.2013.08.006

access: closed

type: Journal Article

metadata version: 2021-10-14

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Mathias Ekpu, Raj S. Bhatti, Michael I. Okereke, Sabuj Mallik, Kenny C. Otiaba:
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectron. Reliab. 54(1): 239-244 (2014)

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