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S. W. Ricky Lee

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Journal Articles

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2016
[j6]
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  dblp key:
  - journals/mr/YangLL16
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  - https://dblp.org/rec/journals/mr/YangLL16
Chaoran Yang, Fuliang Le, S. W. Ricky Lee:
Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints. Microelectron. Reliab. 62: 130-140 (2016)
2014
[j5]
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  - journals/mr/YangSL14
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Chaoran Yang, Fubin Song, S. W. Ricky Lee:
Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints. Microelectron. Reliab. 54(2): 435-446 (2014)
2012
[j4]
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  - journals/mr/LiuLSL12
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Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai:
Reliability of high-power LED packaging and assembly. Microelectron. Reliab. 52(5): 761 (2012)
[j3]
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  - journals/mr/ZhangL12
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Rong Zhang, S. W. Ricky Lee:
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches. Microelectron. Reliab. 52(5): 922-932 (2012)
2011
[j2]
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  - journals/mr/ChenZLM11
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Catherine H. Chen, Shawn X. Zhang, S. W. Ricky Lee, Lebbai Mohamed:
Investigation on copper diffusion depth in copper wire bonding. Microelectron. Reliab. 51(1): 166-170 (2011)
2009
[j1]
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  dblp key:
  - journals/mr/FanLH09
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X. J. Fan, S. W. Ricky Lee, Q. Han:
Experimental investigations and model study of moisture behaviors in polymeric materials. Microelectron. Reliab. 49(8): 861-871 (2009)

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