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"Reliability of high-power LED packaging and assembly."

Cheng-Yi Liu et al. (2012)

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DOI: 10.1016/J.MICROREL.2012.02.023

access: closed

type: Journal Article

metadata version: 2021-10-14

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Cheng-Yi Liu, S. W. Ricky Lee, Moo Whan Shin, Yi-Shao Lai:
Reliability of high-power LED packaging and assembly. Microelectron. Reliab. 52(5): 761 (2012)

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