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ORCIDGuruprasad Katti
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Journal Articles
- 2015
[j4]Guruprasad Katti, S. W. Ho, Li Hong Yu, Songbai Zhang, Rahul Dutta, Roshan Weerasekera
, Ka-Fai Chang, Jong-Kai Lin, Srinivasa Rao Vempati, Surya Bhattacharya:
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). IEEE Des. Test 32(4): 23-31 (2015)- 2012
- [j3]Michele Stucchi, Dimitrios Velenis, Guruprasad Katti:
Capacitance Measurements of Two-Dimensional and Three-Dimensional IC Interconnect Structures by Quasi-Static C-V Technique. IEEE Trans. Instrum. Meas. 61(7): 1979-1990 (2012) - 2011
- [j2]Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal:
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46(1): 293-307 (2011) - 2009
- [j1]Paul Marchal, Bruno Bougard, Guruprasad Katti, Michele Stucchi, Wim Dehaene, Antonis Papanikolaou, Diederik Verkest, Bart Swinnen, Eric Beyne:
3-D Technology Assessment: Path-Finding the Technology/Design Sweet-Spot. Proc. IEEE 97(1): 96-107 (2009)
Conference and Workshop Papers
- 2010
- [c3]Geert Van der Plas, Steven Thijs, Dimitri Linten, Guruprasad Katti, Paresh Limaye, Abdelkarim Mercha, Michele Stucchi, Herman Oprins, Bart Vandevelde, Nikolaos Minas, Miro Cupac, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal:
Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions. CICC 2010: 1-4 - [c2]Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne:
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149 - 2009
- [c1]Jan Van Olmen, Jan Coenen, Wim Dehaene, Kristin De Meyer, Cedric Huyghebaert, Anne Jourdain, Guruprasad Katti, Abdelkarim Mercha, Michal Rakowski, Michele Stucchi, Youssef Travaly, Eric Beyne, Bart Swinnen:
3D Stacked IC demonstrator using Hybrid Collective Die-to-Wafer bonding with copper Through Silicon Vias (TSV). 3DIC 2009: 1-5
Coauthor Index
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