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Bart De Wachter
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2010 – 2019
- 2017
- [c6]Erik Jan Marinissen, Ferenc Fodor, Bart De Wachter, Jorg Kiesewetter, Eric Hill, Ken Smith:
A fully automatic test system for characterizing large-array fine-pitch micro-bump probe cards. ITC-Asia 2017: 144-149 - 2015
- [c5]Erik Jan Marinissen, Bart De Wachter, Teng Wang, Jens Fiedler, Jorg Kiesewetter, Karsten Stoll:
Automated testing of bare die-to-die stacks. ITC 2015: 1-10 - 2014
- [c4]Erik Jan Marinissen, Bart De Wachter, Stephen O'Loughlin, Sergej Deutsch, Christos Papameletis, Tobias Burgherr:
Vesuvius-3D: A 3D-DfT demonstrator. ITC 2014: 1-10 - [c3]Erik Jan Marinissen, Bart De Wachter, Ken Smith, Jorg Kiesewetter, Mottaqiallah Taouil, Said Hamdioui:
Direct probing on large-array fine-pitch micro-bumps of a wide-I/O logic-memory interface. ITC 2014: 1-10 - 2012
- [c2]Wei Guo, Geert Van der Plas, Andrej Ivankovic, Geert Eneman, Vladimir Cherman, Bart De Wachter, Abdelkarim Mercha, Mario Gonzalez, Yann Civale, Augusto Redolfi, Thibault Buisson, A. Jourdan, Bart Vandevelde, Kenneth J. Rebibis, Ingrid De Wolf, Antonio La Manna, Gerald Beyer, Eric Beyne, Bart Swinnen:
3D chip package interaction thermo-mechanical challenges: Proximity effects of Through Silicon vias and μ-bumps. ICICDT 2012: 1-4 - 2011
- [j2]Geert Van der Plas, Paresh Limaye, Igor Loi, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Antonio Pullini, Federico Angiolini, Luca Benini, Wim Dehaene, Youssef Travaly, Eric Beyne, Paul Marchal:
Design Issues and Considerations for Low-Cost 3-D TSV IC Technology. IEEE J. Solid State Circuits 46(1): 293-307 (2011) - 2010
- [j1]Pavel Poliakov, Ankur Anchlia, Marie Garcia Bardon, Bram Rooseleer, Bart De Wachter, Nadine Collaert, Koen van der Zanden, Wim Dehaene, Diederik Verkest, Miguel Corbalan Miranda:
Circuit Design for Bias Compatibility in Novel FinFET-Based Floating-Body RAM. IEEE Trans. Circuits Syst. II Express Briefs 57-II(3): 183-187 (2010) - [c1]Geert Van der Plas, Paresh Limaye, Abdelkarim Mercha, Herman Oprins, Cristina Torregiani, Steven Thijs, Dimitri Linten, Michele Stucchi, Guruprasad Katti, Dimitrios Velenis, Domae Shinichi, Vladimir Cherman, Bart Vandevelde, Veerle Simons, Ingrid De Wolf, Riet Labie, Dan Perry, Stephane Bronckers, Nikolaos Minas, Miro Cupac, Wouter Ruythooren, Jan Van Olmen, Alain Phommahaxay, Muriel de Potter de ten Broeck, Ann Opdebeeck, Michal Rakowski, Bart De Wachter, Morin Dehan, Marc Nelis, Rahul Agarwal, Wim Dehaene, Youssef Travaly, Pol Marchal, Eric Beyne:
Design issues and considerations for low-cost 3D TSV IC technology. ISSCC 2010: 148-149
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