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"Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon ..."

Guruprasad Katti et al. (2015)

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DOI: 10.1109/MDAT.2015.2424429

access: closed

type: Journal Article

metadata version: 2023-09-30

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Guruprasad Katti, S. W. Ho, Li Hong Yu, Songbai Zhang, Rahul Dutta, Roshan Weerasekera, Ka-Fai Chang, Jong-Kai Lin, Srinivasa Rao Vempati, Surya Bhattacharya:
Fabrication and Assembly of Cu-RDL-Based 2.5-D Low-Cost Through Silicon Interposer (LC-TSI). IEEE Des. Test 32(4): 23-31 (2015)

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