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M. Metz

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2023
[c2]
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C. H. Naylor, Kirby Maxey, C. Jezewski, K. P. O'Brien, A. V. Penumatcha, M. S. Kavrik, B. Agrawal, C. V. Littlefield, J. Lux, B. Barley, Justin R. Weber, A. Sen Gupta, C. J. Dorow, N. Arefin, S. King, R. Chebiam, J. Plombon, S. B. Clendenning, U. E. Avci, Mauro J. Kobrinsky, M. Metz:
2D Materials in the BEOL. VLSI Technology and Circuits 2023: 1-2
2022
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Kirby Maxey, C. H. Naylor, K. P. O'Brien, A. Penumatcha, Adedapo Oni, C. Mokhtarzadeh, C. J. Dorow, C. Rogan, B. Holybee, T. Tronic, D. Adams, N. Arefin, A. Sen Gupta, C.-C. Lin, T. Zhong, S. Lee, A. Kitamura, R. Bristol, S. B. Clendenning, U. Avci, M. Metz:
300 mm MOCVD 2D CMOS Materials for More (Than) Moore Scaling. VLSI Technology and Circuits 2022: 419-420

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