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Friedemann Voelklein

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2008
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Stefan Martens, B. Krueger, Walter Mack, Friedemann Voelklein, Jürgen Wilde:
Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. Microelectron. Reliab. 48(8-9): 1513-1516 (2008)

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