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"Low-cost preparation method for exposing IC surfaces in stacked die ..."

Stefan Martens et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.06.033

access: closed

type: Journal Article

metadata version: 2021-08-03

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Stefan Martens, B. Krueger, Walter Mack, Friedemann Voelklein, Jürgen Wilde:
Low-cost preparation method for exposing IC surfaces in stacked die packages by micro-abrasive blasting. Microelectron. Reliab. 48(8-9): 1513-1516 (2008)

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