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Mathias Nowottnick
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- affiliation: University of Rostock, Electrical Engineering, Germany
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Journal Articles
- 2018
- [j6]Dirk Seehase, Christian Kohlen, Arne Neiser, Andrej Novikov, Mathias Nowottnick:
Selective Soldering on Printed Circuit Boards with Endogenous Induction Heat at Appropriate Susceptors. Period. Polytech. Electr. Eng. Comput. Sci. 62(4): 172-180 (2018) - [j5]Allen Jose George, Juergen Zipprich, Marlies Breitenbach, Markus Klingler, Mathias Nowottnick:
Reliability investigation of large area solder joints in power electronics modules and its simulative representation. Microelectron. Reliab. 88-90: 762-767 (2018) - 2017
- [j4]D. Feil, T. Herberholz, M. Guyenot, Mathias Nowottnick:
Highly variable Sn-Cu diffusion soldering process for high performance power electronics. Microelectron. Reliab. 76-77: 455-459 (2017) - 2014
- [j3]Michael Fugger, Mathias Plappert, Carsten Schäffer, Oliver Humbel, Herbert Hutter
, Herbert Danninger, Mathias Nowottnick:
Comparison of WTi and WTi(N) as diffusion barriers for Al and Cu metallization on Si with respect to thermal stability and diffusion behavior of Ti. Microelectron. Reliab. 54(11): 2487-2493 (2014) - 2012
- [j2]Mathias Plappert, Oliver Humbel, Angelika Koprowski, Mathias Nowottnick:
Characterization of Ti diffusion in PVD deposited WTi/AlCu metallization on monocrystalline Si by means of secondary ion mass spectroscopy. Microelectron. Reliab. 52(9-10): 1993-1997 (2012) - 2011
- [j1]Robert Neal Dean, Pradeep Lall, Mathias Nowottnick, William R. Harrell:
Guest Editorial. IEEE Trans. Ind. Electron. 58(7): 2579-2581 (2011)
Coauthor Index
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