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ORCIDLaura Frisk
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Journal Articles
- 2016
[j13]Anniina Parviainen, Kati Kokko, Laura Frisk:
Corrosion testing of anisotropic conductive adhesive interconnections on FR4, liquid crystal polymer and polyimide substrates. Microelectron. Reliab. 56: 114-120 (2016)- 2015
- [j12]Sanna Lahokallio, Kirsi Saarinen-Pulli, Laura Frisk:
Effects of different test profiles of temperature cycling tests on the reliability of RFID tags. Microelectron. Reliab. 55(1): 93-100 (2015) - 2014
- [j11]Sanna Lahokallio, Janne Kiilunen, Laura Frisk:
High temperature reliability of electrically conductive adhesive attached temperature sensors on flexible polyimide substrates. Microelectron. Reliab. 54(9-10): 2017-2022 (2014) - [j10]Juha Pippola, Tuomas Marttila, Laura Frisk:
Protective coatings of electronics under harsh thermal shock. Microelectron. Reliab. 54(9-10): 2048-2052 (2014) - [j9]Laura Frisk, Kirsi Saarinen-Pulli:
Reliability of adhesive joined thinned chips on flexible substrates under humid conditions. Microelectron. Reliab. 54(9-10): 2058-2063 (2014) - [j8]Elena Mengotti, Liliana I. Duarte
, Juha Pippola, Laura Frisk:
Fretting corrosion: Analysis of the failure mechanism for low voltage drives applications. Microelectron. Reliab. 54(9-10): 2109-2114 (2014) - 2012
- [j7]Kirsi Saarinen, Laura Frisk, Leena Ukkonen:
Effects of Cycling Humidity on the Performance of RFID Tags With ACA Joints. IEEE Trans. Reliab. 61(1): 23-31 (2012) - 2010
- [j6]Johanna Virkki, Tomi Seppälä, Laura Frisk, Pekka Heino:
Accelerated testing for failures of tantalum capacitors. Microelectron. Reliab. 50(2): 217-219 (2010) - [j5]Kati Kokko, Anniina Parviainen, Laura Frisk:
Corrosion protection of anisotropically conductive adhesive joined flip chips. Microelectron. Reliab. 50(8): 1152-1158 (2010) - [j4]Johanna Virkki, A. Koskenkorva, Laura Frisk:
Development of a matrix test board for capacitor reliability testing. Microelectron. Reliab. 50(9-11): 1711-1714 (2010) - 2005
- [j3]Laura Frisk, Eero Ristolainen:
Flip chip attachment on flexible LCP substrate using an ACF. Microelectron. Reliab. 45(3-4): 583-588 (2005) - 2004
- [j2]Laura Frisk, Anne Seppälä, Eero Ristolainen:
Effect of bonding pressure on reliability of flip chip joints on flexible and rigid substrates. Microelectron. Reliab. 44(9-11): 1305-1310 (2004) - 2002
- [j1]Laura Frisk, J. Järvinen, R. Ristolainen:
Chip on flex attachment with thermoplastic ACF for RFID applications. Microelectron. Reliab. 42(9-11): 1559-1562 (2002)
Coauthor Index
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