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Publication search results
found 21 matches
- 2016
- Abderrahmane Baïri:
Free convective heat transfer coefficient for high powered and tilted QFN64 electronic device. Microelectron. Reliab. 66: 85-91 (2016) - Sihem Bouguezzi, Moez Ayadi, Moez Ghariani:
Developing a Simplified Analytical Thermal Model of Multi-chip Power Module. Microelectron. Reliab. 66: 64-77 (2016) - Camille Durand, Markus Klingler, Maxence Bigerelle, Daniel Coutellier:
Solder fatigue failures in a new designed power module under Power Cycling. Microelectron. Reliab. 66: 122-133 (2016) - Bo Huang, Xunbo Li, Zhi Zeng, Nanbo Chen:
Mechanical behavior and fatigue life estimation on fretting wear for micro-rectangular electrical connector. Microelectron. Reliab. 66: 106-112 (2016) - Asiri Jayawardena, Nadarajah Narendran:
Analysis of electrical parameters of InGaN-based LED packages with aging. Microelectron. Reliab. 66: 22-31 (2016) - Hongjun Ji, Jiao Wang, Mingyu Li:
Microstructure and reliability of hybrid interconnects by Au stud bump with Sn-0.7Cu solder for flip chip power device packaging. Microelectron. Reliab. 66: 134-142 (2016) - Michael Knetzger, Elke Meissner, Joff Derluyn, Marianne Germain, Jochen Friedrich:
Correlation of carbon doping variations with the vertical breakdown of GaN-on-Si for power electronics. Microelectron. Reliab. 66: 16-21 (2016) - Lingling Li, Yahui Xu, Zhigang Li, Pengchong Wang, Bing Wang:
The effect of electro-thermal parameters on IGBT junction temperature with the aging of module. Microelectron. Reliab. 66: 58-63 (2016) - Fan Li, Wenguo Zhang, Li-Lan Gao, Hong Gao:
The coupled effects of salt-spray corrosion, electrical current and mechanical load on the electrical and fatigue properties of COG assembly. Microelectron. Reliab. 66: 92-97 (2016) - Wei Liang, Aihua Dong, Hang Li, Meng Miao, Chung-Chen Kuo, Maxim Klebanov, Juin J. Liou:
Characteristics of ESD protection devices operated under elevated temperatures. Microelectron. Reliab. 66: 46-51 (2016) - Changjun Liao, Jizhi Liu, Zhiwei Liu:
New fast turn-on speed SCR device for electrostatic discharge protection. Microelectron. Reliab. 66: 38-45 (2016) - Yang Liu, Changchun Chai, Qingyang Fan, ChunLei Shi, Xiaowen Xi, Xinhai Yu, Yintang Yang:
Ku band damage characteristics of GaAs pHEMT induced by a front-door coupling microwave pulse. Microelectron. Reliab. 66: 32-37 (2016) - Fei Chong Ng, Aizat Abas, Muhammad Hafifi Hafiz Ishak, Mohd Zulkifly Abdullah, M. S. Abdul Aziz:
Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. Microelectron. Reliab. 66: 143-160 (2016) - Ah-Young Park, Satish C. Chaparala, Seungbae Park:
Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface. Microelectron. Reliab. 66: 113-121 (2016) - Anis Souari, Claude Thibeault, Yves Blaquière, Raoul Velazco:
Towards an efficient SEU effects emulation on SRAM-based FPGAs. Microelectron. Reliab. 66: 173-182 (2016) - Shrikant Swaminathan, Kamal K. Sikka, Richard F. Indyk, Tuhin Sinha:
Measurement of underfill interfacial and bulk fracture toughness in flip-chip packages. Microelectron. Reliab. 66: 161-172 (2016) - J. Thambi, U. Tetzlaff, Andreas Schiessl, Klaus-Dieter Lang, M. Waltz:
High cycle fatigue behaviour and generalized fatigue model development of lead-free solder alloy based on local stress approach. Microelectron. Reliab. 66: 98-105 (2016) - YanLing Wang, Xiaojin Li, Jian Qing, Yan Zeng, Yanling Shi, Ao Guo, ShaoJian Hu, Shoumian Chen, Yuhang Zhao:
Analytical parameter extraction for NBTI reaction diffusion and trapping/detrapping models. Microelectron. Reliab. 66: 10-15 (2016) - Daisuke Yamane, Toshifumi Konishi, Teruaki Safu, Hiroshi Toshiyoshi, Masato Sone, Kazuya Masu, Katsuyuki Machida:
Evaluation and modeling of adhesion layer in shock-protection structure for MEMS accelerometer. Microelectron. Reliab. 66: 78-84 (2016) - Yuwei Zhai, Faguo Liang, Chunsheng Guo, Yan Liu:
Transient dual interface measurement of junction-to-case thermal resistance in AlGaN/GaN HEMT utilizing an improved infrared microscope. Microelectron. Reliab. 66: 52-57 (2016) - Wu Zhou, Jiangbo He, Xiao-Ping He, Huijun Yu, Bei Peng:
Dielectric charging induced drift in micro device reliability-a review. Microelectron. Reliab. 66: 1-9 (2016)
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retrieved on 2024-05-25 23:38 CEST from data curated by the dblp team
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