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"Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially ..."

Hao Yu et al. (2008)

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DOI: 10.1109/TVLSI.2008.2001297

access: closed

type: Journal Article

metadata version: 2022-12-13

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Hao Yu, Yiyu Shi, Lei He, Tanay Karnik:
Thermal Via Allocation for 3-D ICs Considering Temporally and Spatially Variant Thermal Power. IEEE Trans. Very Large Scale Integr. Syst. 16(12): 1609-1619 (2008)

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