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ORCID"Economizing TSV Resources in 3-D Network-on-Chip Design."
Ying Wang et al. (2015)
- Ying Wang, Yinhe Han, Lei Zhang, Binzhang Fu, Cheng Liu, Huawei Li, Xiaowei Li
:
Economizing TSV Resources in 3-D Network-on-Chip Design. IEEE Trans. Very Large Scale Integr. Syst. 23(3): 493-506 (2015)
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