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"Postbond Test of Through-Silicon Vias With Resistive Open Defects."
Rosa Rodríguez-Montañés, Daniel Arumí, Joan Figueras (2019)
- Rosa Rodríguez-Montañés
, Daniel Arumí
, Joan Figueras:
Postbond Test of Through-Silicon Vias With Resistive Open Defects. IEEE Trans. Very Large Scale Integr. Syst. 27(11): 2596-2607 (2019)
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