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"Scan Test of Die Logic in 3-D ICs Using TSV Probing."

Brandon Noia et al. (2015)

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DOI: 10.1109/TVLSI.2014.2306951

access: closed

type: Journal Article

metadata version: 2022-10-02

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  - https://dblp.org/rec/journals/tvlsi/NoiaPCL15
Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim:
Scan Test of Die Logic in 3-D ICs Using TSV Probing. IEEE Trans. Very Large Scale Integr. Syst. 23(2): 317-330 (2015)

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