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"Thermal-Aware Methodology for Repeater Insertion in Low-Power VLSI Circuits."

Ja Chun Ku, Yehea I. Ismail (2007)

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DOI: 10.1109/TVLSI.2007.900749

access: closed

type: Journal Article

metadata version: 2020-03-11

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  - https://dblp.org/rec/journals/tvlsi/KuI07
Ja Chun Ku, Yehea I. Ismail:
Thermal-Aware Methodology for Repeater Insertion in Low-Power VLSI Circuits. IEEE Trans. Very Large Scale Integr. Syst. 15(8): 963-970 (2007)

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