"Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield Enhancement."

Shengcheng Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori (2019)

Details and statistics

DOI: 10.1109/TCAD.2018.2864291

access: closed

type: Journal Article

metadata version: 2020-09-24

a service of  Schloss Dagstuhl - Leibniz Center for Informatics