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"A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC."

Tianming Ni et al. (2021)

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DOI: 10.1109/TCAD.2020.3025169

access: closed

type: Journal Article

metadata version: 2021-09-01

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  - journals/tcad/NiXHLYW21
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  - https://dblp.org/rec/journals/tcad/NiXHLYW21
Tianming Ni, Qi Xu, Zhengfeng Huang, Huaguo Liang, Aibin Yan, Xiaoqing Wen:
A Cost-Effective TSV Repair Architecture for Clustered Faults in 3-D IC. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 40(9): 1952-1956 (2021)

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