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ORCID"TSV-Aware Interconnect Distribution Models for Prediction of Delay and ..."
Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim (2014)
- Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim
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TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(9): 1384-1395 (2014)
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