"TSV-Aware Interconnect Distribution Models for Prediction of Delay and ..."

Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim (2014)

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DOI: 10.1109/TCAD.2014.2329472

access: closed

type: Journal Article

metadata version: 2022-10-02

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Daehyun Kim, Saibal Mukhopadhyay, Sung Kyu Lim:
TSV-Aware Interconnect Distribution Models for Prediction of Delay and Power Consumption of 3-D Stacked ICs. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. 33(9): 1384-1395 (2014)

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