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"Reliability model of bond wire fatigue for IGBT in MMC with system ..."

Tao Zheng et al. (2018)

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DOI: 10.1016/J.MICROREL.2018.07.099

access: closed

type: Journal Article

metadata version: 2021-02-15

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Tao Zheng, Meng Huang, Yi Liu, Xiaoming Zha:
Reliability model of bond wire fatigue for IGBT in MMC with system redundancy consideration. Microelectron. Reliab. 88-90: 1164-1167 (2018)

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