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"Reliability study of underfill/chip interface under accelerated ..."

Y. L. Zhang, D. X. Q. Shi, Wei Zhou (2006)

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DOI: 10.1016/J.MICROREL.2005.04.012

access: closed

type: Journal Article

metadata version: 2020-10-27

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Y. L. Zhang, D. X. Q. Shi, Wei Zhou:
Reliability study of underfill/chip interface under accelerated temperature cycling (ATC) loading. Microelectron. Reliab. 46(2-4): 409-420 (2006)

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