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"Effect of process-induced voids on isothermal fatigue resistance of CSP ..."

Qiang Yu et al. (2008)

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DOI: 10.1016/J.MICROREL.2007.08.008

access: closed

type: Journal Article

metadata version: 2020-02-22

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Qiang Yu, Tadahiro Shibutani, Do-Seop Kim, Yusuke Kobayashi, Jidong Yang, Masaki Shiratori:
Effect of process-induced voids on isothermal fatigue resistance of CSP lead-free solder joints. Microelectron. Reliab. 48(3): 431-437 (2008)

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