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"Power modules die attach: A comprehensive evolution of the nanosilver ..."

Toni Youssef et al. (2015)

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DOI: 10.1016/J.MICROREL.2015.06.085

access: closed

type: Journal Article

metadata version: 2020-02-22

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  - https://dblp.org/rec/journals/mr/YoussefRWAVMMQR15
Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard:
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity. Microelectron. Reliab. 55(9-10): 1997-2002 (2015)

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