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"Solder reflow process induced residual warpage measurement and its ..."

Se Young Yang et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.06.007

access: closed

type: Journal Article

metadata version: 2020-02-22

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Se Young Yang, Young-Doo Jeon, Soon-Bok Lee, Kyung-Wook Paik:
Solder reflow process induced residual warpage measurement and its influence on reliability of flip-chip electronic packages. Microelectron. Reliab. 46(2-4): 512-522 (2006)

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