"Effect of bonding duration and substrate temperature in copper ball ..."

H. Xu et al. (2011)

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DOI: 10.1016/J.MICROREL.2010.03.016

access: closed

type: Journal Article

metadata version: 2020-02-22

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H. Xu, C. Liu, Vadim V. Silberschmidt, Zhong Chen, J. Wei, M. Sivakumar:
Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution. Microelectron. Reliab. 51(1): 113-118 (2011)

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