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"Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder ..."

H. X. Xie, Nikhilesh Chawla, Yu-Lin Shen (2011)

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DOI: 10.1016/J.MICROREL.2011.02.005

access: closed

type: Journal Article

metadata version: 2022-06-17

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H. X. Xie, Nikhilesh Chawla, Yu-Lin Shen:
Mechanisms of deformation in high-ductility Ce-containing Sn-Ag-Cu solder alloys. Microelectron. Reliab. 51(6): 1142-1147 (2011)

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