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"The effect of downscaling the dimensions of solder interconnects on their ..."

Steffen Wiese et al. (2008)

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DOI: 10.1016/J.MICROREL.2008.03.026

access: closed

type: Journal Article

metadata version: 2022-10-02

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Steffen Wiese, Mike Roellig, Maik Mueller, Klaus-Jürgen Wolter:
The effect of downscaling the dimensions of solder interconnects on their creep properties. Microelectron. Reliab. 48(6): 843-850 (2008)

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