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"Reliability evaluations for board-level chip-scale packages under coupled ..."

Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin (2008)

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DOI: 10.1016/J.MICROREL.2007.02.011

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Hong Wang, Yi-Shao Lai, Yu-Cheng Lin:
Reliability evaluations for board-level chip-scale packages under coupled power and thermal cycling test conditions. Microelectron. Reliab. 48(1): 132-139 (2008)

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