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"Experimental verification of models for underfill flow driven by capillary ..."
J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom (2008)
- J. W. Wan, Wen-Jun Zhang
, D. J. Bergstrom:
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. Microelectron. Reliab. 48(3): 425-430 (2008)
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