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"Experimental verification of models for underfill flow driven by capillary ..."

J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom (2008)

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DOI: 10.1016/J.MICROREL.2007.06.006

access: closed

type: Journal Article

metadata version: 2023-03-21

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J. W. Wan, Wen-Jun Zhang, D. J. Bergstrom:
Experimental verification of models for underfill flow driven by capillary forces in flip-chip packaging. Microelectron. Reliab. 48(3): 425-430 (2008)

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