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"Four-point bending cycling: The alternative for thermal cycling solder ..."
Bart Vandevelde et al. (2017)
- Bart Vandevelde, Filip Vanhee, Davy Pissoort
, Lieven Degrendele, Johan de Baets, Bart Allaert, Ralph Lauwaert, Franco Zanon, Riet Labie, Geert Willems:
Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components. Microelectron. Reliab. 74: 131-135 (2017)
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