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"Thermal deformation measurements and predictions of MAP-BGA electronic ..."

Ming-Yi Tsai et al. (2006)

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DOI: 10.1016/J.MICROREL.2005.02.014

access: closed

type: Journal Article

metadata version: 2024-05-02

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Ming-Yi Tsai, W. C. Chiang, T. M. Liu, G. H. Hsu:
Thermal deformation measurements and predictions of MAP-BGA electronic packages. Microelectron. Reliab. 46(2-4): 476-486 (2006)

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