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"Reliability and failure analysis of fine copper wire bonds encapsulated ..."
Yanhong Tian et al. (2011)
- Yanhong Tian, Chunjin Hang, Chunqing Wang
, G. Q. Ouyang, D. S. Yang, J. P. Zhao:
Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectron. Reliab. 51(1): 157-165 (2011)
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