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"Board level solder joint reliability analysis of stacked die mixed ..."

Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong (2006)

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DOI: 10.1016/J.MICROREL.2006.01.010

access: closed

type: Journal Article

metadata version: 2020-02-22

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Tong Yan Tee, Hun Shen Ng, Zhaowei Zhong:
Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA. Microelectron. Reliab. 46(12): 2131-2138 (2006)

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