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"Mapping the failure envelope of board-level solder joints."

Long Bin Tan et al. (2009)

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DOI: 10.1016/J.MICROREL.2008.12.013

access: closed

type: Journal Article

metadata version: 2020-10-26

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Long Bin Tan, Xiaowu Zhang, Chwee Teck Lim, Vincent B. C. Tan:
Mapping the failure envelope of board-level solder joints. Microelectron. Reliab. 49(4): 397-409 (2009)

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