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Xiaowu Zhang
This is just a disambiguation page, and is not intended to be the bibliography of an actual person. Any publication listed on this page has not been assigned to an actual author yet. If you know the true author of one of the publications listed below, you are welcome to contact us.
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2020 – today
- 2024
- [j23]Li He, Xiaowu Zhang, Jianyong Duan, Hao Wang, Xin Li, Liang Zhao:
PSDSpell: Pre-Training with Self-Distillation Learning for Chinese Spelling Correction. IEICE Trans. Inf. Syst. 107(4): 495-504 (2024) - [j22]Chaobin Xu
, Wei Li, Xiaohui Cui, Zhenyu Wang, Fengling Zheng, Xiaowu Zhang, Bin Chen:
Scarcity-GAN: Scarce data augmentation for defect detection via generative adversarial nets. Neurocomputing 566: 127061 (2024) - 2023
- [j21]Yaxin Zhao, Yuebing Xu
, Jiadong Ye, Xiaowu Zhang, Zuqiang Long:
Urban Water Supply Forecasting Based on CNN-LSTM-AM Spatiotemporal Deep Learning Model. IEEE Access 11: 144204-144212 (2023) - [j20]Shasha Sun
, Wenxing Bao
, Kewen Qu
, Wei Feng
, Xiaowu Zhang, Xuan Ma:
Hyperspectral Image Super-Resolution Algorithm Based on Graph Regular Tensor Ring Decomposition. Remote. Sens. 15(20): 4983 (2023) - [c10]Jianli Bai
, Xiangfu Song
, Xiaowu Zhang
, Qifan Wang
, Shujie Cui
, Ee-Chien Chang
, Giovanni Russello
:
Mostree: Malicious Secure Private Decision Tree Evaluation with Sublinear Communication. ACSAC 2023: 799-813 - [c9]Jianli Bai, Xiaowu Zhang, Xiangfu Song, Hang Shao, Qifan Wang, Shujie Cui, Giovanni Russello:
CryptoMask: Privacy-Preserving Face Recognition. ICICS 2023: 333-350 - [c8]Hao Guo
, Wenxing Bao, Wei Feng, Shasha Sun, Lei Yang, Kewen Qu, Xuan Ma, Xiaowu Zhang:
Multispectral and Hyperspectral Image Fusion Based on Coupled Non-Negative Block Term Tensor Decomposition with Joint Structured Sparsity. IGARSS 2023: 7376-7379 - [c7]Yuanbin Xu
, Tian Tian
, Pingfei Zhu
, Xiaowu Zhang
, Tongwei Li
, Yuqing Chen
:
Research on optimization algorithm of business system design based on graph theory and its application in digital power marketing business system design. IoTAAI 2023: 295-307 - [i5]Zhanwen Zhou, Hankz Hankui Zhuo, Xiaowu Zhang, Qiyuan Deng:
XRoute Environment: A Novel Reinforcement Learning Environment for Routing. CoRR abs/2305.13823 (2023) - [i4]Jianli Bai, Xiaowu Zhang, Xiangfu Song, Hang Shao, Qifan Wang, Shujie Cui, Giovanni Russello:
CryptoMask : Privacy-preserving Face Recognition. CoRR abs/2307.12010 (2023) - [i3]Xiaowu Zhang, Xiaotian Zhang, Cheng Yang, Hang Yan, Xipeng Qiu:
Does Correction Remain A Problem For Large Language Models? CoRR abs/2308.01776 (2023) - [i2]Jianli Bai, Xiangfu Song, Xiaowu Zhang, Qifan Wang, Shujie Cui, Ee-Chien Chang, Giovanni Russello:
Mostree : Malicious Secure Private Decision Tree Evaluation with Sublinear Communication. CoRR abs/2309.17124 (2023) - 2022
- [j19]Hongbo Liang
, Wenxing Bao
, Xiangfei Shen
, Xiaowu Zhang:
HSI-Mixer: Hyperspectral Image Classification Using the Spectral-Spatial Mixer Representation From Convolutions. IEEE Geosci. Remote. Sens. Lett. 19: 1-5 (2022) - [j18]Xiangfei Shen
, Wenxing Bao
, Hongbo Liang
, Xiaowu Zhang, Xuan Ma:
Grouped Collaborative Representation for Hyperspectral Image Classification Using a Two-Phase Strategy. IEEE Geosci. Remote. Sens. Lett. 19: 1-5 (2022) - [c6]Meng Cao, Wenxing Bao, Kewen Qu, Xiaowu Zhang, Xuan Ma:
Nonlocal Low-Rank Regularization for Hyperspectral and High-Resolution Remote Sensing Image Fusion. IGARSS 2022: 1444-1447 - 2021
- [j17]Hongbo Liang
, Wenxing Bao
, Xiangfei Shen
, Xiaowu Zhang:
Spectral-Spatial Attention Feature Extraction for Hyperspectral Image Classification Based on Generative Adversarial Network. IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens. 14: 10017-10032 (2021) - [c5]Xiaowu Zhang, Li Li:
Attentional Neural Factorization Machines for Knowledge Tracing. KSEM 2021: 319-330 - [c4]Qun Zhou, Wenxing Bao
, Xiaowu Zhang, Xuan Ma:
A Joint Spatial-Spectral Representation Based Capsule Network for Hyperspectral Image Classification. WHISPERS 2021: 1-5 - 2020
- [j16]Weichao Zhuang
, Xiaowu Zhang
, Guodong Yin
, Huei Peng
, Liangmo Wang:
Mode Shift Schedule and Control Strategy Design of Multimode Hybrid Powertrain. IEEE Trans. Control. Syst. Technol. 28(3): 804-815 (2020) - [c3]Sishun Liu, Pengju Shuai, Xiaowu Zhang, Shuang Chen, Li Li, Ming Liu:
Fine-Tuned Transformer Model for Sentiment Analysis. KSEM (2) 2020: 336-343
2010 – 2019
- 2018
- [j15]Qingfeng Lin
, Shengbo Eben Li
, Xuejin Du
, Xiaowu Zhang
, Huei Peng
, Yugong Luo, Keqiang Li
:
Minimize the Fuel Consumption of Connected Vehicles Between Two Red-Signalized Intersections in Urban Traffic. IEEE Trans. Veh. Technol. 67(10): 9060-9072 (2018) - 2017
- [i1]Weichao Zhuang, Xiaowu Zhang, Ding Zhao, Huei Peng, Lianmou Wang:
Optimal design of three-planetary-gear power-split hybrid powertrains. CoRR abs/1708.00151 (2017) - 2016
- [j14]Fa Xing Che
, Xiaowu Zhang
, Jong-Kai Lin:
Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis. Microelectron. Reliab. 61: 64-70 (2016) - [j13]Shaobing Xu
, Shengbo Eben Li
, Huei Peng, Bo Cheng, Xiaowu Zhang, Ziheng Pan:
Fuel-Saving Cruising Strategies for Parallel HEVs. IEEE Trans. Veh. Technol. 65(6): 4676-4686 (2016) - [j12]Xiaowu Zhang, Shengbo Eben Li
, Huei Peng, Jing Sun
:
Design of Multimode Power-Split Hybrid Vehicles - A Case Study on the Voltec Powertrain System. IEEE Trans. Veh. Technol. 65(6): 4790-4801 (2016) - 2015
- [j11]Yong Han, Boon Long Lau, Boo Yang Jung, Xiaowu Zhang
:
Heat Dissipation Capability of a Package-on-Package Embedded Wafer-Level Package. IEEE Des. Test 32(4): 32-39 (2015) - [j10]Xiaowu Zhang, Huei Peng, Jing Sun
:
A Near-Optimal Power Management Strategy for Rapid Component Sizing of Multimode Power Split Hybrid Vehicles. IEEE Trans. Control. Syst. Technol. 23(2): 609-618 (2015) - [j9]Shaobing Xu
, Shengbo Eben Li
, Xiaowu Zhang, Bo Cheng, Huei Peng:
Fuel-Optimal Cruising Strategy for Road Vehicles With Step-Gear Mechanical Transmission. IEEE Trans. Intell. Transp. Syst. 16(6): 3496-3507 (2015) - 2013
- [c2]Xiaowu Zhang, Huei Peng, Jing Sun:
A near-optimal power management strategy for rapid component sizing of power split hybrid vehicles with multiple operating modes. ACC 2013: 5972-5977 - 2012
- [j8]A. D. Trigg, Tai Chong Chai, Xiaowu Zhang
, Xian Tong Chen, Leong Ching Wai:
Modular sensor chip design for package stress evaluation and reliability characterisation. Microelectron. Reliab. 52(8): 1581-1585 (2012) - [j7]Xiaowu Zhang, Chiao-Ting Li, Dongsuk Kum, Huei Peng:
Prius+ and Volt-: Configuration Analysis of Power-Split Hybrid Vehicles With a Single Planetary Gear. IEEE Trans. Veh. Technol. 61(8): 3544-3552 (2012) - 2011
- [c1]Xiaowu Zhang, Ranjan Rajoo, F. X. Che, C. S. Selvanayagam, W. K. Choi, Shan Gao, Guo-Qiang Lo, Dim-Lee Kwong:
A low stress bond pad design optimization of low temperature solder interconnections on TSVs for MEMS applications. 3DIC 2011: 1-5 - 2010
- [j6]Yue Ying Ong, Soon Wee Ho, Kripesh Vaidyanathan, Vasarla Nagendra Sekhar, Ming Chinq Jong, Samuel Lim Yak Long, Vincent Lee Wen Sheng, Leong Ching Wai, Vempati Srinivasa Rao, Jimmy Ong, Xuefen Ong, Xiaowu Zhang
, Yoon Uk Seung, John H. Lau, Yeow Kheng Lim
, David Yeo, Kai Chong Chan, Yanfeng Zhang, Juan Boon Tan, Dong Kyun Sohn:
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package. Microelectron. Reliab. 50(7): 986-994 (2010) - [j5]Yung Chuen Tan
, Cher Ming Tan
, Xiaowu Zhang
, Tai Chong Chai, D. Q. Yu:
Electromigration performance of Through Silicon Via (TSV) - A modeling approach. Microelectron. Reliab. 50(9-11): 1336-1340 (2010)
2000 – 2009
- 2009
- [j4]Long Bin Tan
, Xiaowu Zhang
, Chwee Teck Lim
, Vincent B. C. Tan:
Mapping the failure envelope of board-level solder joints. Microelectron. Reliab. 49(4): 397-409 (2009) - 2008
- [j3]Xiaowu Zhang
, Kripesh Vaidyanathan, Tai Chong Chai, Teck Chun Tan, D. Pinjala:
Board level solder joint reliability analysis of a fine pitch Cu post type wafer level package (WLP). Microelectron. Reliab. 48(4): 602-610 (2008) - 2005
- [j2]Xiaowu Zhang
, Ee-Hua Wong
, Ranjan Rajoo, Mahadevan K. Iyer, J. F. J. M. Caers, X. J. Zhao:
Development of process modeling methodology for flip chip on flex interconnections with non-conductive adhesives. Microelectron. Reliab. 45(7-8): 1215-1221 (2005) - 2004
- [j1]Xiaowu Zhang
, Ee-Hua Wong
, Charles Lee, Tai Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath:
Thermo-mechanical finite element analysis in a multichip build up substrate based package design. Microelectron. Reliab. 44(4): 611-619 (2004)
Coauthor Index
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last updated on 2024-08-05 21:10 CEST by the dblp team
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