Stop the war!
Остановите войну!
for scientists:
default search action
"Digital image correlation for solder joint fatigue reliability in ..."
Yaofeng Sun, John H. L. Pang (2008)
- Yaofeng Sun, John H. L. Pang:
Digital image correlation for solder joint fatigue reliability in microelectronics packages. Microelectron. Reliab. 48(2): 310-318 (2008)
manage site settings
To protect your privacy, all features that rely on external API calls from your browser are turned off by default. You need to opt-in for them to become active. All settings here will be stored as cookies with your web browser. For more information see our F.A.Q.