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"Influence of bonding process parameters on chip cratering and phase ..."

Stefan Schmitz, Martin Schneider-Ramelow, S. Schröder (2011)

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DOI: 10.1016/J.MICROREL.2010.07.062

access: closed

type: Journal Article

metadata version: 2020-02-22

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Stefan Schmitz, Martin Schneider-Ramelow, S. Schröder:
Influence of bonding process parameters on chip cratering and phase formation of Cu ball bonds on AlSiCu during storage at 200 °C. Microelectron. Reliab. 51(1): 107-112 (2011)

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